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HyperX Impact 8GB (2x 4GB) 1866MHz DDR3L RAM  - (RAM2413)

£60.83 inc VAT


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Main Features

  • Voltage: 1.35V
  • Latency Timing: CL11
  • Speed: 1866MHz (PC3-15000)
  • non-ECC Unbuffered Memory

Overview

HyperX® Impact memory boasts the world’s fastest SO-DIMM frequency – 2666MHz – to keep you ahead of the curve and level up your game. It automatically recognises the platform it’s plugged into and auto overclocks to the highest frequency published (up to 2400MHz) with no need to adjust system BIOS settings. So you get extreme performance that supports notebooks using either AMD or the latest Intel CPU technologies with no hassle at all – even if you’re a newbie.

HyperX HX318LS11IBK2/8 is a kit of two 512M x 64-bit (4GB) DDR3L-1866 CL11 SDRAM (Synchronous DRAM) 1Rx8, low voltage, memory modules, based on eight 512M x 8-bit DDR3 FBGA components per module. Total kit capacity is 8GB. Each module kit has been tested to run at DDR3L-1866 at a low latency timing of 11-11-11 at 1.35V or 1.5V.

Main Features:

  • JEDEC standard 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V) Power Supply
  • VDDQ = 1.35V (1.28V ~ 1.45V) and 1.5V (1.425V ~ 1.575V)
  • 933MHz fCK for 1866Mb/sec/pin
  • 8 independent internal bank
  • Programmable CAS Latency: 13, 11, 10, 9, 8, 7, 6, 5
  • Programmable Additive Latency: 0, CL - 2, or CL - 1 clock
  • 8-bit pre-fetch
  • Burst Length: 8 (interleave without any limit, sequential with starting address '000' only), 4 with tCCD = 4 which does not allow seamless read or write (either on the fly using A12 or MRS)
  • Bi-directional Differential Data Strobe
  • Internal (self) calibration: Internal self calibration through ZQ pin (RZQ: 240 ohm ± 1%)
  • On Die Termination using ODT pin
  • Average Refresh Period 7.8us at lower than TCASE 85°C, 3.9us at 85°C < TCASE < 95°Cº
  • Asynchronous Reset
  • PCB: Height 1.180 inch (30.00mm), double sided component

Specifications

Memory
Memory Speed 1866 MHz
Designation PC3-14900
Pin Configuration 204 pins
CAS Latency CL11
Memory Type DDR3L
Memory Size 8192 MB
Number of Modules 2 module(s)
Module Size 4096 MB
Memory Package SO-DIMM
Bus I/O Configuration Unbuffered
Error Correction Non-ECC
Electrical
Voltage 1.35 V
Environmental
Operating Temperature 0 to 85 °C
Non Operating Temperature -55 to +100 °C
Physical
Form Factor Memory Kit
Case Colour Black
Item Details
Manufacturer HyperX
Part Number HX318LS11IBK2/8
UPC 740617233391
Condition New

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